ee:pcbfoametching
Differences
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| Both sides previous revision Previous revision Next revision | Previous revision | ||
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ee:pcbfoametching [2022/02/16 13:32] 21960@students.hsrw |
ee:pcbfoametching [2024/12/12 15:29] (current) FKR@staff.hsrw |
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| - place board in etching foam using the rack hanger of the clamp ensuring the complete board is submerged within the etching foam. | - place board in etching foam using the rack hanger of the clamp ensuring the complete board is submerged within the etching foam. | ||
| - Wait for the etching process to complete. You may have to wait a couple of minutes before something seems to be happening but from this point it should be going quite fast and obvious. To check etching please rinse in neutralization solution to allow better inspection. | - Wait for the etching process to complete. You may have to wait a couple of minutes before something seems to be happening but from this point it should be going quite fast and obvious. To check etching please rinse in neutralization solution to allow better inspection. | ||
| + | - In case you now notice that developing was too short, you can clean the PCB and develop it a little further, before completing the etching process. | ||
| - Continue etching until complete. this process should take around 4-6 minutes. Do not wait to long as it will affect the protected traces as well if you wait too long. | - Continue etching until complete. this process should take around 4-6 minutes. Do not wait to long as it will affect the protected traces as well if you wait too long. | ||
| - Rinse the board thoroughly with the rinsing function. | - Rinse the board thoroughly with the rinsing function. | ||
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| - dry the board using paper towels | - dry the board using paper towels | ||
| - Use alcohol wipes to remove the remaining photo-resist from the board. Be thorough, this will show up as blackness on wipe. | - Use alcohol wipes to remove the remaining photo-resist from the board. Be thorough, this will show up as blackness on wipe. | ||
| + | - If you do not plan on soldering the PCBs on the same day, use solderable protective resin ("Lötlack") to protect the copper from oxidizing. | ||
| - Dispose of waste properly. | - Dispose of waste properly. | ||
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| Via's Component Placement and soldering | Via's Component Placement and soldering | ||
| - | PCB's use two types of technologies for connecting components that require different ways of soldering. due to the nature of the PCB constuction used in the labs will require via's to be manually placed | + | PCB's use two types of technologies for connecting components that require different ways of soldering being THT and SMD. due to the nature of the PCB construction used in the labs will require via's to also be manually placed. |
| Via's | Via's | ||
| + | Available sizes for punching via's in the university: 0.6 mm (drill 0.9 mm, pad 1.5 mm) and 1.0 mm (drill 1.5 mm, pad 2.5 mm). | ||
| + | To place a via in your PCB | ||
| + | - drill the correct size hole for the desired size via at the wanted location. | ||
| + | -correctly select and set the manual via press in place on a steady surface. | ||
| + | -place the desired sized via so it sits on the suitable sized pin of the press with the flange of the via resting at the bottom (use of tweezers recommended). | ||
| + | -Place PCB so via sits in correct position and gently but firmly press down handle of press. | ||
| - | Through hole Technologies | ||
| + | Through hole Technologies THT | ||
| - | Surface Mounted Technologies | + | |
| + | |||
| + | Surface Mounted Technologies SMD | ||
ee/pcbfoametching.1645014743.txt.gz · Last modified: 2022/02/16 13:32 by 21960@students.hsrw
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