This shows you the differences between two versions of the page.
| Both sides previous revision Previous revision | |||
|
ee:pcbdesign [2025/10/26 10:48] FKR@staff.hsrw |
ee:pcbdesign [2025/11/14 16:47] (current) FKR@staff.hsrw |
||
|---|---|---|---|
| Line 37: | Line 37: | ||
| ===== misc ===== | ===== misc ===== | ||
| Use SMT footprints you can handle, e.g. 1206 for standard resistors and capacitors | Use SMT footprints you can handle, e.g. 1206 for standard resistors and capacitors | ||
| + | |||
| + | |||
| + | |||
| + | ===== Design rules Düngelhoef ===== | ||
| + | ATTENTION! If you want to have your PCB produced at HSRW, it is really important that you have read and understood the following in order to avoid problems later on! | ||
| + | Design Rules For Etching At HSRW | ||
| + | =>PCB dimensions: | ||
| + | -Max. 100 x 160 mm | ||
| + | =>Minimum Feature Sizes | ||
| + | ->Copper features & Trace Width | ||
| + | -Recommended: 0.6mm | ||
| + | -Minimum: 0.4mm | ||
| + | ->Distance Copper/Copper (Isolation distances) | ||
| + | -Recommended: 0.6mm | ||
| + | -Minimum: 0.4mm | ||
| + | ->Available Via Sizes | ||
| + | -Small (Via 0.6mm, Pad 1.5mm, drill 0.9mm); | ||
| + | -Large (Via 1mm, Pad 2.5mm, drill 1.5mm) | ||
| + | =>Other Important Things | ||
| + | -Through hole parts located on the top have to be connected on the bottom layer | ||
| + | -Through hole parts located on the bottom layer have to be connected from the top | ||
| + | -You may otherwise be unable to solder your parts properly! | ||
| + | WARNING: Not following these rules is risky and may often lead to a defective PCB! | ||
| + | |||