This shows you the differences between two versions of the page.
Both sides previous revision Previous revision Next revision | Previous revision | ||
ee:pcbdesign [2021/10/08 09:35] FKR@staff.hsrw |
ee:pcbdesign [2023/11/28 12:30] (current) FKR@staff.hsrw |
||
---|---|---|---|
Line 6: | Line 6: | ||
==== Design considerations for self-etched PCBs at the university ==== | ==== Design considerations for self-etched PCBs at the university ==== | ||
+ | |||
+ | The biggest PCB blanks we stock at the university are 160 mm by 100 mm. Your designs should not be bigger than that. | ||
Available sizes for punching vias in the university: 0.6 mm (drill 0.9 mm, pad 1.5 mm) and 1.0 mm (drill 1.5 mm, pad 2.5 mm). | Available sizes for punching vias in the university: 0.6 mm (drill 0.9 mm, pad 1.5 mm) and 1.0 mm (drill 1.5 mm, pad 2.5 mm). | ||
Line 22: | Line 24: | ||
- | Through-Hole Components need to be routed to at the bottom layer. | + | Through-hole (THT) components need to be routed to at the bottom layer. |
===== Common mistakes ===== | ===== Common mistakes ===== |