ee:pcbdesign
Differences
This shows you the differences between two versions of the page.
| Both sides previous revision Previous revision Next revision | Previous revision | ||
|
ee:pcbdesign [2019/01/14 18:24] FKR@staff.hsrw |
ee:pcbdesign [2025/11/14 16:47] (current) FKR@staff.hsrw |
||
|---|---|---|---|
| Line 5: | Line 5: | ||
| [[https://www.aetzwerk.de/eagle|Ätzwerk files for EAGLE design rule check]] | [[https://www.aetzwerk.de/eagle|Ätzwerk files for EAGLE design rule check]] | ||
| + | ==== Design considerations for self-etched PCBs at the university ==== | ||
| + | The biggest PCB blanks we stock at the university are 160 mm by 100 mm. Your designs should not be bigger than that. | ||
| Available sizes for punching vias in the university: 0.6 mm (drill 0.9 mm, pad 1.5 mm) and 1.0 mm (drill 1.5 mm, pad 2.5 mm). | Available sizes for punching vias in the university: 0.6 mm (drill 0.9 mm, pad 1.5 mm) and 1.0 mm (drill 1.5 mm, pad 2.5 mm). | ||
| + | Große Nieten (Innendurchmesser = 1 mm): | ||
| + | |||
| + | Passendes Via: | ||
| + | Bohrung (= Bohrlochdurchmesser): 1,5 mm | ||
| + | Durchmesser (= Außendurchmesser): 2,5 mm | ||
| + | |||
| + | |||
| + | Kleine Nieten (Innendurchmesser = 0,6 mm): | ||
| + | |||
| + | Passendes Via: | ||
| + | Bohrung (= Bohrlochdurchmesser): 0,9 mm | ||
| + | Durchmesser (= Außendurchmesser): 1,5 mm | ||
| + | |||
| + | |||
| + | Through-hole (THT) components need to be routed to at the bottom layer. | ||
| + | |||
| + | ===== Common mistakes ===== | ||
| + | Trust in autorouter | ||
| + | |||
| + | Wrong track size | ||
| + | |||
| + | Use of discontinued or unavailable components | ||
| + | |||
| + | No prototyping/simulation | ||
| + | |||
| + | ===== misc ===== | ||
| + | Use SMT footprints you can handle, e.g. 1206 for standard resistors and capacitors | ||
| + | |||
| + | |||
| + | |||
| + | ===== Design rules Düngelhoef ===== | ||
| + | ATTENTION! If you want to have your PCB produced at HSRW, it is really important that you have read and understood the following in order to avoid problems later on! | ||
| + | Design Rules For Etching At HSRW | ||
| + | =>PCB dimensions: | ||
| + | -Max. 100 x 160 mm | ||
| + | =>Minimum Feature Sizes | ||
| + | ->Copper features & Trace Width | ||
| + | -Recommended: 0.6mm | ||
| + | -Minimum: 0.4mm | ||
| + | ->Distance Copper/Copper (Isolation distances) | ||
| + | -Recommended: 0.6mm | ||
| + | -Minimum: 0.4mm | ||
| + | ->Available Via Sizes | ||
| + | -Small (Via 0.6mm, Pad 1.5mm, drill 0.9mm); | ||
| + | -Large (Via 1mm, Pad 2.5mm, drill 1.5mm) | ||
| + | =>Other Important Things | ||
| + | -Through hole parts located on the top have to be connected on the bottom layer | ||
| + | -Through hole parts located on the bottom layer have to be connected from the top | ||
| + | -You may otherwise be unable to solder your parts properly! | ||
| + | WARNING: Not following these rules is risky and may often lead to a defective PCB! | ||
| + | |||
ee/pcbdesign.1547486671.txt.gz · Last modified: 2021/03/08 13:39 (external edit)
Page Tools
