Differences

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 Via's Component Placement and soldering
-PCB's use two types of technologies for connecting components that require different ways of soldering. due to the nature of the PCB constuction used in the labs will require via's to be manually placed
+PCB's use two types of technologies for connecting components that require different ways of soldering being THT and SMD. due to the nature of the PCB construction used in the labs will require via's to also be manually placed.
 Via's
+Available sizes for punching via's in the university: 0.6 mm (drill 0.9 mm, pad 1.5 mm) and 1.0 mm (drill 1.5 mm, pad 2.5 mm).
+To place a via in your PCB
+- drill the correct size hole for the desired size via at the wanted location.
+-correctly select and set the manual via press in place on a steady surface.
+-place the desired sized via so it sits on the suitable sized pin of the press with the flange of the via resting at the bottom (use of tweezers recommended).
+-Place PCB so via sits in correct position and gently but firmly press down handle of press.
-Through hole Technologies
+Through hole Technologies THT
-Surface Mounted Technologies
+Surface Mounted Technologies SMD